US President Joe Biden arrives for a ceremony at the groundbreaking of the Intel semiconductor manufacturing facility near New Albany, Ohio in 2022. He will be in Arizona late today. The U.S.

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

Toshiba Corp. has developed a new chip production technology that increases by 50 percent the number of layers of components that can be crammed inside a standard Multi Chip Package (MCP) for use in ...

South Korea increased its aid package for the semiconductor industry to 33T won (about $23.25B) from the 26T won package introduced last year, Reuters reported. The move comes after calls to the ...

The A20 chip that will be used in the iPhone 18 could be packaged with a new tech that will give Apple more configuration options, while still being as small as possible. Apple's chips, produced by ...

The issue of MEMS-based system solutions and their packaging will be addressed at the MEMS Industry Group’s annual MEMS Executive Congress, which will be held in Scottsdale AZ on November 3-5, 2010, ...

South Korea will start granting aid to chip manufacturers from its 26T won (about $19B) package from July to boost domestic semiconductor manufacturing, Bloomberg News reported. The Asian country will ...

Raytheon’s new $20 million contract to develop a multichip package for use in airborne, maritime and ground sensors comes amid a broader push to strengthen the defense industrial base. Credit: Alamy ...

Alpha and Omega Semiconductor Limited released a family of low on-resistance 8V, 20V, and 30V MOSFETs in the ultra-thin molded chip scale package (MCSP). The MCSP devices feature a maximum height of ...